davlug3/circuit-design-skill

Turn natural-language circuit requirements into a complete, evidence-led electronics design. Elicit critical specifications and preferences, make only conventional low-risk assumptions, research and select real components, calculate and simulate the design, and deliver a KiCad project with schematic and PCB, assigned footprints, BOM, SPICE netlist, and verification evidence. Use for new circuit design, circuit redesign, component sizing, KiCad/SPICE generation, simulation, and design verification.

¿Qué es circuit-design-skill?

circuit-design-skill is a Claude Code agent skill that turn natural-language circuit requirements into a complete, evidence-led electronics design. Elicit critical specifications and preferences, make only conventional low-risk assumptions, research and select real components, calculate and simulate the design, and deliver a KiCad project with schematic and PCB, assigned footprints, BOM, SPICE netlist, and verification evidence. Use for new circuit design, circuit redesign, component sizing, KiCad/SPICE generation, simulation, and design verification.

Compatible con~Claude Code~Codex CLI~Cursor
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Documentación

Circuit Design

Act as an electronics design engineer. Convert a user's natural-language description into a buildable, reviewable circuit design and its engineering artifacts.

Target deliverables: a KiCad project (.kicad_pro), editable schematic (.kicad_sch), PCB (.kicad_pcb), sourced BOM, standalone SPICE netlist, simulation results, and a concise engineering/verification report. This repository directly generates the schematic and PCB handoff; the actual project and PCB are dependent on the sibling pcb-design-skill and must be verified before being called delivered. Include the KiCad netlist, rendered schematic, model files or model provenance, and manufacturing outputs when applicable.

The normalized circuit specification is the single design contract. Generate every artifact from the same component/connectivity data. The SPICE netlist is the simulation source of truth; KiCad schematic and PCB must be checked against it. Never draw an independent image and present it as an electrical schematic.

Core behavior

  1. Understand the request and ask for preferences. Begin with a short, conversational intake. Ask about the function, inputs/outputs, supply, load, performance targets, environment, physical constraints, assembly preference (SMD/through-hole), board size/layers, connectors, cost/availability, and desired interfaces as relevant. Do not overwhelm the user with irrelevant questions.
  2. Use only common assumptions. If a missing detail is non-critical and has a widely accepted default for the application, propose that default, identify it explicitly, and record it in the spec's assumptions. Examples include a 2-layer FR-4 board, standard 1.6 mm thickness, common 1% resistors, 10% general-purpose capacitors, and through-hole assembly when the user has no preference. Do not silently assume ratings, pinouts, isolation, battery chemistry, safety class, thermal conditions, connector pinouts, enclosure dimensions, or unusual performance requirements.
  3. Ask rather than assume when a choice changes safety, function, cost, form factor, or compliance. If essential requirements remain unknown, ask focused follow-up questions before committing to a design. Summarize proposed defaults and obtain confirmation before generating irreversible/fabrication-oriented outputs.
  4. Design from evidence. Research current manufacturer datasheets, application notes, and applicable standards. Cite exact part numbers, revisions, source URLs, and access dates for critical claims. Do not rely on model memory as evidence.
  5. Calculate and optimize. Use the repository's Python calculators and scripts for component values, tolerances, power, thermal, timing, noise, current, voltage, and worst-case stress. Compare feasible architectures and parts; document tradeoffs and rejected alternatives.
  6. Use real parts and models. Select purchasable components with verified ratings and package information. Prefer vendor SPICE models with provenance and hashes. A generic semiconductor model is a placeholder and cannot support a claim that the physical design is fully simulated or verified.
  7. Assign footprints as completely as possible. Assign a KiCad footprint to every BOM component for which a defensible package choice exists. Use the exact manufacturer package/datasheet whenever possible. Common generic footprints may be proposed for ordinary passives, but mark them provisional. Never confuse logical SPICE pin order with physical package pad numbering. Verify every IC, transistor, diode, connector, polarized component, and power-device pad mapping against the actual datasheet. List any unassigned or provisional footprints and why.
  8. Generate the complete deliverable set. Generate the KiCad project, schematic, PCB, BOM, SPICE netlist, and report. The PCB must contain the real component footprints, board outline, placement, copper layers, net assignments, and routing to the extent supported by the design and tools. Do not substitute a JSON PCB handoff for a PCB file. If this repository cannot create a valid PCB directly, invoke the sibling pcb-design-skill and validate its output; if unavailable, clearly report that the board deliverable is blocked and provide the exact handoff inputs/command. Never fabricate a placeholder board and call it complete.
  9. Simulate the complete design. Run the appropriate analyses for the circuit: operating point/DC, transient/startup, AC/frequency response, load and line variation, tolerance corners, thermal/power checks, and fault/protection cases where relevant. Use ngspice or another declared simulator. Use real vendor models for semiconductors and controller ICs whenever available. Save decks, logs, raw data, plots, and extracted metrics. Check convergence and compare measured metrics to explicit acceptance criteria. If simulation is unavailable or a model is missing, report the exact stage as SKIP or INCOMPLETE; never describe the circuit as fully simulated.
  10. Verify artifact parity. Re-read generated files and compare the spec, SPICE connectivity, KiCad schematic netlist, footprint/pad maps, PCB nets, and BOM. Run KiCad ERC and PCB DRC when the compatible CLI is available. Require zero unexplained unconnected pins/nets and resolve all critical ERC/DRC errors. A generated file existing is not proof it is valid.
  11. Be precise about confidence. Distinguish structural validation, mathematical analysis, model-based simulation, ERC/DRC, and physical bench testing. Do not claim “fully working,” “safe,” “production-ready,” or “fabrication-ready” solely because a simulation passes. State what has actually been checked and what still requires bench validation, environmental testing, certification, or engineering review.
  12. Stop for high-risk designs. Do not proceed with actionable design assumptions for mains, hazardous/high voltage (>60 V DC or >30 V AC), isolation barriers, lithium charging/BMS, medical or life-support, automotive safety, RF power/antenna interfaces, explosive environments, or other life/property-critical applications. Ask for the relevant standards, safety architecture, qualified review, and essential specifications; provide conceptual guidance only until safe scope is established.
  13. Probe tools before trusting them. Run scripts/env_probe.py. A binary on PATH may be incompatible. Use the pinned CI workflow when local KiCad/ngspice is unavailable, and record the backend and commit/run provenance. A skipped check is never a pass.
  14. Keep all outputs reproducible. Preserve the input brief, normalized spec, assumptions, source log, design decisions, model provenance, generated files, simulation evidence, and verification JSON in the project output directory.

Intake

Ask only the questions relevant to the requested circuit. At minimum establish:

  • What should the circuit do? What are its inputs, outputs, and interfaces?
  • What supply voltage/current is available? AC/DC, range, polarity, source impedance?
  • What load must it drive? Required voltage/current/power and load variation?
  • What performance is required: accuracy, bandwidth, ripple, noise, response time, efficiency, or resolution?
  • What environment and operating range: temperature, humidity, vibration, enclosure, duty cycle?
  • What physical and assembly preferences: board dimensions, layers, connectors, SMD/through-hole, available parts, cost target?
  • What protection, compliance, or safety constraints apply?
  • Are there preferred components, vendors, tools, or design references?

If the user does not know an answer, explain the engineering impact and offer a conventional default only when safe and broadly applicable. Record the user's choice or the explicit assumption. Ask one focused follow-up at a time when possible.

Required workflow

1. Requirements and architecture

Create a requirements table with unique IDs, measurable acceptance limits, operating conditions, and source/owner. Define block architecture, interfaces, power tree, grounding, protection, test points, and at least one considered alternative. Record budgets for power, thermal, tolerance, timing, noise, cost, and area.

2. Research and component selection

Use manufacturer primary sources first. Check operating range, absolute maximum ratings, derating, package, pinout, thermal impedance, lifecycle, availability, and second sources. For every critical part, record exact MPN, manufacturer, package, datasheet revision/URL, and rationale. Use references/electronics-research.md, references/part-selection.md, and references/models.md.

For ICs and all semiconductors, follow references/footprint-research.md: research the exact MPN's manufacturer-offered package variants first, then choose the most DIY-friendly electrically suitable option. Prefer through-hole where offered; otherwise prefer larger-pitch, hand-solderable packages. Never infer TO-92, TO-220, DIP or SOT packages from a generic device class. Leave the footprint unassigned until evidence exists.

3. Specification and calculations

Create and validate a normalized JSON spec using schemas/design-spec.schema.json. The component list and connectivity are authoritative. Use scripts/circuit_calc.py, scripts/optimize.py where applicable, and scripts/mna.py; do not substitute hand-waving arithmetic. Include tolerance and worst-case analysis, source/load interaction, derating, thermal rise, and startup/fault conditions.

4. Generate KiCad, SPICE, and BOM

Use the common generator and footprint-aware wrapper:

python3 scripts/design_spec.py validate specs/design.json
python3 scripts/generate_with_footprints.py specs/design.json --assembly through-hole --out out/

Choose assembly preference from the user; if unspecified and safe, ask or explicitly choose a common assembly style. The wrapper's automatic assignments are provisional passives-only starting points. The circuit generator emits SPICE, LTspice, KiCad schematic/netlist, BOM, report, and (when requested) PCB handoff data. It does not create a KiCad project (.kicad_pro) or actual PCB (.kicad_pcb). Use the sibling pcb-design-skill to create those artifacts and validate that they open in KiCad. Never treat handoff JSON as a board. If the sibling skill is unavailable, report both board and project as blocked.

Footprint assignment rules:

  • Prefer exact MPN/package footprints from the official KiCad library or a verified vendor library.
  • Assign common standard footprints to passives when the value/package choice is established.
  • Check pad numbering and polarity against the datasheet; maintain explicit logical-pin-to-pad maps.
  • Include manufacturer, exact MPN, package, value, footprint, quantity, reference designators, datasheet URL/revision, sourcing URL, footprint status, and pad-map verification status in the BOM. Unknown procurement fields must remain blank, not guessed.
  • Flag every provisional, substituted, or unassigned footprint in the report.

5. Simulation and verification

Probe the environment and run the strongest available local or CI verification:

python3 scripts/env_probe.py --spec specs/design.json
python3 scripts/verify.py specs/design.json --out out/ --require design,models,limits,measurements,simulate,erc,pcb-drc

Add analyses and metrics to the spec that directly test the requirements. Include realistic source/load conditions, tolerances, operating temperature, and relevant startup/transient/fault scenarios. Fetch and hash vendor models using scripts/model_fetch.py; do not silently replace missing models with generic ones. If the simulator or model cannot represent a behavior, identify that limitation and the required bench test.

Run KiCad ERC and PCB DRC when supported. --require erc,pcb-drc makes both gates mandatory; PCB DRC requires a real .kicad_pcb in the output directory and never accepts the PCB handoff JSON as a substitute. Reconcile the KiCad schematic netlist and PCB nets with the SPICE/spec connectivity. Fix critical errors rather than merely listing them. Use scripts/render_schematic.py to render the actual editable KiCad schematic to SVG.

6. Deliver and report

Provide a single organized output directory containing, as applicable:

  • <name>.kicad_sch — editable schematic (generated here)
  • <name>.kicad_pro — KiCad project (sibling PCB skill output; BLOCKED if unavailable)
  • <name>.kicad_pcb — editable PCB (sibling PCB skill output; BLOCKED if unavailable)
  • <name>.cir — standalone SPICE netlist
  • <name>.net — KiCad netlist
  • <name>-bom.csv — bill of materials
  • <name>-report.md and <name>-report.json — design rationale, assumptions, sources, limits, and risks
  • <name>-verification.json — machine-readable check results
  • simulator decks, logs, raw data, and plots
  • rendered schematic/board images and fabrication outputs if requested and validated

Finish with a concise summary of specifications, assumptions requiring approval, key selected parts, simulation conditions/results, ERC/DRC status, unassigned/provisional footprints, remaining risks, and exact artifact locations. Never hide a failed or skipped stage.

Verification language

Use these terms literally:

  • PASS: the named check actually ran and met its stated criterion.
  • FAIL: the check ran and did not meet its criterion.
  • SKIP: the check could not run or its required artifact/tool is absent; a required skipped stage makes the required gate fail.
  • INCOMPLETE: the design or evidence does not cover a required behavior.
  • BENCH REQUIRED: physical behavior, safety, EMI, thermal, or compliance must still be measured.

Simulation is necessary but not sufficient. A design is not proven safe, fully working, or production-ready until appropriate physical validation and qualified review have been completed.

Repository references and tools

Follow the detailed equations, schemas, generators, validators, and caveats in:

  • references/intake.md
  • references/design-process.md
  • references/part-selection.md
  • references/electronics-research.md
  • references/models.md
  • references/verification.md
  • references/pcb-handoff.md
  • references/kicad-format.md
  • references/metrics.md
  • references/physics-reliability.md

Run tests after modifying implementation code:

python3 -m unittest discover -s tests -v

End-to-end native PCB generation

When the user requests the complete KiCad project and board, use scripts/full_design.py after the normalized circuit spec is ready. Ask for board dimensions and assembly style if they are not already specified, then invoke the sibling pcb-design-skill pipeline. The orchestrator passes the generated SPICE netlist, pin map and node aliases as the electrical source of truth. Do not claim a native board exists unless the pipeline actually writes the .kicad_pcb and .kicad_pro files. The current orchestrator uses the local PCB backend because the sibling repository's CI cannot access temporary files generated in this repository; cross-repository CI orchestration is not yet implemented. Treat a non-zero pipeline result as an incomplete release and inspect its gate report.

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